IST is an accelerated stress test method that overcomes the limitations of thermal oven or liquid / liquid methods, IST has the capability of effective / rapidly quantifying the integrity of both the Plated Through Hole (PTH) and the unique ability to identify the presence and levels of post separations within the multilayer board. IST creates a uniform strain from within the substrate, the interconnects ability to distribute and redistribute this strain provides an indication of integrity. The plated barrels and inner layer junctions are “exercised” until the initial failure mode/mechanism is uncovered.
Following several years of intense evaluation, the IPC have approved the IST technology as the first electrical test methodology for assessing plate through hole integrity and for the detection of post separation. The IST methodology is issued in the IPC-TM-650 Test Methods Manual.
IST has become the leading test standard for via and material reliability. Top OEMs, ODMs, CDMs, Material and PCB manufacturers around the world use IST technology to test new materials and processes.
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