PWB Interconnect Solutions, Canada


PWB: IST - Interconnect Stress Test System

IST is an accelerated stress test method that overcomes the limitations of thermal oven or liquid / liquid methods, IST has the capability of effective / rapidly quantifying the integrity of both the Plated Through Hole (PTH) and the unique ability to identify the presence and levels of post separations within the multilayer board. IST creates a uniform strain from within the substrate, the interconnects ability to distribute and redistribute this strain provides an indication of integrity. The plated barrels and inner layer junctions are “exercised” until the initial failure mode/mechanism is uncovered.

Following several years of intense evaluation, the IPC have approved the IST technology as the first electrical test methodology for assessing plate through hole integrity and for the detection of post separation. The IST methodology is issued in the IPC-TM-650 Test Methods Manual.

IST has become the leading test standard for via and material reliability. Top OEMs, ODMs, CDMs, Material and PCB manufacturers around the world use IST technology to test new materials and processes.

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Download IPC-TM-650 Test Methods

IST-HC - New Eight Head Dual Sense IST-High Capacity System. Contact us for more details.

PWB: DELAM - Dielectric Estimation and Laminate Analysis Measurement System

PWB Interconnect Solutions Inc. has developed a tool that automatically measures and analyzes changes in material properties that signify whether damage was caused by exposure to the elevated temperatures associated with component assembly and possible reworks. This unique technology complements their IST testing capability. The principles used by this tool have proven to be an effective methodology in determining whether the materials used in printed wiring boards are capable of withstanding the cyclic exposure to temperatures that exceed the materials inherent robustness.

The test system incorporates a high precision LCR (capacitance) meter which is interfaced to a user friendly application software, which automatically measures, records, analyzes, displays and reports all key test parameters

Download PWB’s DELAM Test Method

COMPIX Model 222 - Radiometric Thermal Imaging Camera

The 222 is a calibrated, radiometric, real time thermal imaging camera. It requires little power and needs no cryogenic cooling. It uses an amorphous silicon microbolometer detector and produces 160X120 pixel images.

In an IST evaluation, testing automatically stops when a circuit reaches a 10% increase in resistance. The failing coupons have circuits that are still electrically conductive but have a modest increase in resistance. Now, since the test stopped well before catastrophic failure it is still possible to identify the exact microvia that is contributing the highest resistance to the circuit using thermo-graphic techniques.

This process is called 'Failure Location' and involves the use of the 222. Since the failed circuit has only experienced a 10% change in resistance, a DC current can be applied causing the failing interconnection to heat. The compromised via has a higher resistance, compared to other connecting traces and so it will become the hottest structure in the coupon. The thermographic 222 camera allows direct visualization of the exact location of the hottest microvia. The worst case failing microvia is seen as high temperature hot spot on the surface, thus making the COMPIX 222 a powerful tool.

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