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ACVS delivers precise and efficient analysis for next gen high speed interconnect across Interposer, Package and PCBs including HBM, UCIe and PCIe applications. Ideal for delivering fast and accurate results on detailed complex analysis and reporting workflows for ANSYS based designs. Comprehensive results for key parameters include losses, reflections, crosstalk, TDR/TDR, eye-diagrams and BER, delivering unparallel accuracy and efficiency for high-speed system designs.
Key benefits:
- Automatic System Configuration and Simulation
- SimX engine for large scale S- parameter with 1000+ ports and 100GB+ file size
- Supports precise and efficient analysis of (LP), DDR, HBB, UCIe, PCIe
- Provides fully customisation reports to meet specific customer design needs.