Xpeedic: ViaExpert – Via Modeling and Simulation

ViaExpert provides a fast and accurate way to model and simulate vias. It allows designers at the pre-layout stage to quickly build via models and check the key signal integrity metrics such as insertion loss, return loss, and crosstalk. It also allows designer to perform post-layout simulation of vias and trace breakout.

To quickly build via models, ViaExpert provides multiple ways including built-in templates, direct layout file import and a combined flow which takes advantage of both the layout trace breakout and built-in templates. ViaExpert deploys two field solver technologies, Finite Element Method (FEM) solver, and the another a hybrid field solver. Both adopt distributed processing and multi-core parallelization, which adds another level of acceleration to model computation.

Key Features

• Optimization mesh improves the simulation accuracy and speed
• Fast 3D FEM and hybrid solver offers better capacity and speed compared to other tools in market
• Support HPC, remote and local simulation under the management of XDPM (Xpeedic Distributed Processing Management) module to maximize high computing machine availability
• Built-in connector footprint library, easy to build connector via model
• Multiple ways to create Via models or import Cadence .brd, .mcm, .sip file
• Support arbitrary Via array definition, move, duplicate, align top / bottom / left / right, distribute horizontally / vertically, undo and redo features in 2D footprint window
• Easy to add Via tear drop and trace compensation
• Easy to modify stackup, trace length, trace width, pad size and antipad size
• Support arbitrary parameterized keepout definition, management and usage in 2D footprint window to explore the optimal antipad geometry, the keepout shape can be defined by the unite of lines / arcs or regular parameterized geometries
• Optimize routing method and support to define trace by axis or segment
• Auto port generation, simplifies EM analysis setup
• 3D-View makes the model check easier
• Support parametric and optimization sweep simulation
• Support export models to third-party tools, such as HFSS or CST

Download ViaExpert Brochure